Ultrafast Laser Processing: From Micro- to Nanoscale

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Product Details
Price
$218.50
Publisher
Jenny Stanford Publishing
Publish Date
Pages
616
Dimensions
5.9 X 9.1 X 1.5 inches | 2.2 pounds
Language
English
Type
Hardcover
EAN/UPC
9789814267335

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About the Author

Koji Sugioka is a senior research scientist at RIKEN and a guest professor at Tokyo University of Science and Tokyo Denki University, Japan. He received his PhD in electronics from Waseda University, Japan, in 1993. Since he joined RIKEN in 1986, he has been working on laser materials processing. His current interests center on the development of advanced laser micro/nanoprocessing, with applications related to lab-on-a-chip, photonic, and electronic devices. His accomplishments include 7 awards, about 130 articles, and about 80 invited talks at international conferences. He is the editor-in-chief of the Journal of Laser Micro/Nanoengineering, a board member of the Laser Institute of America and Japan Laser Processing Society, and an SPIE Fellow.

Ya Cheng is a professor of the Shanghai Institute of Optics and Fine Mechanics (SIOM), Chinese Academy of Sciences, and the deputy director of the State Key Laboratory of High Field Laser Physics, SIOM. He received his BS from Fudan University, China, in 1993 and PhD from SIOM in 1998. Since 1995, he has been working in the fields related to ultrafast photonics. His current research interests include femtosecond laser micromachining, ultrafast nonlinear optics, and strong-field laser physics. He has published more than 100 papers in peer-reviewed journals and given more than 60 invited talks at international conferences. He is an editor of Laser Micro/Nanoengineering and Chinese Physics Letters and the deputy secretary general of the Chinese Optical Society.

Reviews

"This would be an outstanding book for researchers or application engineers who want to learn about the uses of ultrafast lasers for micro- and nano-material processing. The practical information on materials IEEE Electrical Insulation Magazine processes and the well-written background fundamentals are particularly helpful."
-IEEE Electrical Insulation Magazine, September/October 2014 - Vol. 30, No. 5